Sr. Manager Thermal and Mechanical Analysis

You will architect and optimize the core of our cutting-edge semiconductor products, overseeing a team of experts specializing in Thermo-mechanical design. This critical role demands a seasoned leader experience managing complex analysis functions, responsible for establishing state-of-the-art simulation methodologies, ensuring error-free tape-outs and driving innovation that directly influences our technology roadmap and competitive edge. If you possess a deep understanding of advanced 2D/2.5D & 3D packaging, excel in managing people and vendor relationships, and are eager to define the future of technology  Responsibilities Lead and manage a cross-disciplinary team of 6- 8 engineers with expertise across thermal & thermo-mechanical analysis, and mechanical design domains  Develop and implement state-of-the-art analysis techniques to provide accurate, predictable, and high-confidence thermal and thermo-mechanical analysis. This encompasses photonic and electronic chips (PIC, EIC), advanced 2.5D and 3D Co-Packaged Optics (CPO) packages, and the complex interactions within these systems Develop validation techniques and drive appropriate data collection activities (in-house and in collaboration with external labs) to deliver high confidence in analysis outcomes Participate in design reviews at program levels and publish documents to support evidence-based indicators of risk levels at each program level milestone Establish and evaluate group accomplishments against defined objectives and key results Maintain and develop capabilities by recruiting appropriate talent and continuing to review employee’s skill set requirements & training to meet business needs. Ensure a safe, secure, and legal work environment Responsible for employee performance management and development Qualifications MS or PhD in Mechanical Engineering, or a closely related field is required A minimum of 8+ years of demonstrated domain expertise in Thermal and Mechanical Design, including proficiency in simulation techniques such as Finite Element Analysis, is essential At least 5 years of verifiable experience in leading and managing a multi-physics engineering analysis team is necessary Expertise in the development of advanced (2.5D, 3D, CPO) package assembly and test processes, with a proven ability to address reliability challenges through rigorous analysis, design of experiments and guiding failure analysis. Proficient in lab-scale validation techniques, material characterization and expertise in the use of simulation or MCAD tools such as Solidwork, Ansys, or Flotherm Extensive experience in collaborating with external vendors and suppliers is required A solid understanding of software tools and requisite IT infrastructure is preferred Preferred Qualifications Knowledge of EDA tools such as Mentor Graphics, Allegro  Ability to work independently, lead a team, and manage multiple projects simultaneously Strong communication skills and a track record of successful collaboration in cross-functional team environments Creative thinker with strong problem solving skills