About the Role
<p><strong>Responsibilities:</strong></p>
<ul>
<li>Define & deploy new component technology platforms in a cross-functional team for new product applications through testing, simulation, and prototypes.</li>
<li>Qualification of components for use in surface-mount electronic assembly manufacturing processes.</li>
<li>Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.</li>
<li>Lead testing and validation of components for high-reliability applications by performing use case-based electrical and environmental stress tests.</li>
<li>Implementation tasks include leading stage-gate approvals, documentation, supplier quality interface, characterization, verification, and ongoing sustaining support in a highly automated manufacturing environment.</li>
</ul>
<p><strong>Qualifications:</strong></p>
<p><strong>Education / Experience Requirements:</strong></p>
<ul>
<li>B.Sc. or M.Sc. in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement</li>
<li>Excellent written and verbal communication skills; detail-oriented</li>
<li>3+ years of experience with chip-scale packaging, direct bump attach, copper pillar, and similar technologies</li>
<li>Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach, their materials, and processes.</li>
<li>Detailed knowledge of IC packaging failure modes and root cause analysis techniques</li>
<li>Experience in high high-reliability electronics manufacturing environment</li>
<li>Experience with quality systems, including technical writing of quality-relevant documentation</li>
<li>Strong physics-based reasoning</li>
<li>Experience with failure analysis and root cause corrective action with suppliers</li>
<li>Demonstrated ability to conceive, implement, and complete engineering projects and experiments on schedule</li>
<li>Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc.)</li>
<li>Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.</li>
<li>Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.</li>
</ul>